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    [分享]華中理工大學(xué)碩士研究生論文(LED的封裝) [復(fù)制鏈接]

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    離線faithlu
     
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    只看樓主 倒序閱讀 樓主  發(fā)表于: 2007-03-15
    摘  要 GQ9\'z#+  
    隨著發(fā)光材料的開發(fā)和半導(dǎo)體制作工藝的改進,白光LED的發(fā)展迅速,它已經(jīng)趨向取代傳統(tǒng)的照明,白光LED的光效已經(jīng)由以前的20lm/w上升到了45lm/w。由于白光LED具有的長壽命、無污染、低功耗的特性,未來LED還將逐步替代熒光燈、白熾燈成為下一代綠色照明光源。 tb$LriN  
    本文首先簡單介紹LED的概念、特點、分類以及現(xiàn)階段全球和國內(nèi)LED技術(shù)研究的進展,提出了現(xiàn)階段白光LED存在的問題。 V\^EfQ  
    接著根據(jù)白光LED所存在的問題,對白光LED的封裝工藝和原材料的選擇搭配進行改進,在本文中白光LED有兩種封裝方式,一種是支架式封裝形式,一種是大功率LED的封裝形式。整個封裝設(shè)計過程從以下幾個方面進行的: @ ]/AjjLt  
    (1)熒光粉涂抹的方式。熒光粉的涂抹方式對白光LED的發(fā)光分布與色溫的均勻度影響很大,熒光粉厚度較厚的位置黃光產(chǎn)生較多,色溫會較低,因此在芯片上形成的涂抹層必須是均勻。 q~*t@  
    (2)散熱的研究。由于結(jié)溫的上升會使發(fā)光復(fù)合的幾率下降,發(fā)光二極管的亮度就會下降,壽命和輸出光通也會隨著溫度的升高而下降,如果PN結(jié)產(chǎn)生的熱量能盡快的散發(fā)出去,不僅提高產(chǎn)品的發(fā)光效率,同時也提高了產(chǎn)品的可靠性和壽命。 qU#BJON]BR  
    (3)封裝原材料的選擇。外封裝材料的選擇是建立在散熱的基礎(chǔ)上的,因此芯片、基板、支架、散熱器和填充材料必須是低熱阻,高導(dǎo)熱率的材質(zhì)。 H Ge0hl[n  
    最后是對封裝好的兩種白光LED的特性參數(shù)進行了測試和分析,并且通過改變封裝條件進一步探討和分析了兩種封裝方式。 `kU/NKq  
    D?0zhU  
    關(guān)鍵詞:固體照明  白光半導(dǎo)體發(fā)光二極管  封裝工藝  熒光粉  散熱 []A%<EI7  
    hNd}Y'%V  
    Abstract #3_*]8K.R  
    With the development of material and the innovation of semiconductor manufacture technology, the efficiency of White LED is increasing from 20 to 45 lumens/watt, and has already begun to exceed that of incandescent lamps.  Their life characteristics are important factors. When LEDs replace filter white light sources or colored neon lamps in signage, decorative and signaling applications, they will often be viable and efficient alternative. So LEDs will take a new era in “green lighting”. AKRTBjG"  
    First, The thesis introduces the concept and characteristics of LED and the development of LED technology research in the world and in china. |Tm!VFd  
    Secondly, It states the package process of White LED in detail and discusses the following aspects: ,;(PwJe  
    One aspect is the coating method of phosphor, which influences the LED’s  color temperature and  range of available color properties, so,phosphor coating in manufacturing process must be uniform in thickness. DXa-rk8  
    Another aspect is the heat dissipated. In general, the cooler the environment, the higher an LED’s light output will be. Higher temperatures generally reduce light output. and LED’s life. If the heat within the junction is dissipated by convection and conduction, their useful life and the efficiency of LED would be increase. >&p0d0  
    The last aspect is the selection of material which include phosphors, chip, heat sinking and substrate.  All material must be excellent conductors of heat. vh*U]3@  
    Thirdly, we obtain the data from measuring two kinds of White LED with different packaging process and draw a conclusion. {WPobP"  
    RW