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光行天下 -> 訊技光電&黌論教育 -> 用于仿真和分析激光晶體封裝技術中誘導應力的方法 [點此返回論壇查看本帖完整版本] [打印本頁]

infotek 2024-10-22 07:55

用于仿真和分析激光晶體封裝技術中誘導應力的方法

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提出了一種用來仿真激光晶體封裝技術中的誘導應力的方法,并對激光腔內(nèi)部的雙折射效應進行研究。這種方法已經(jīng)由軟件ANSYS 17.0通過熱機械仿真來實現(xiàn)。ANSYS的結(jié)果稍后被導入到VirtualLab Fusion軟件中,這款軟件按照波長及偏振性對輸入輸出光束進行分析。研究是建立在一種用于玻璃或晶體光學封裝中低應力焊接技術,也被稱作焊機泵浦技術的背景下。分析結(jié)果表明對于由釔鋁石榴石活性激光晶體構(gòu)建的激光腔,二次諧波發(fā)生器β-鋇硼酸鹽,以及由低應力焊機泵浦技術組裝的熔融石英的輸出激光鏡來說,輸入及輸出激光光束幾乎沒有差異。 Ed ?Yk* 4  
○c2017 Optical Society of America OCIS codes: (140.0140) Lasers and laser optics; (220.0220) Optical design and fabrication; (260.1440) Birefringence. `"bRjC"f]  
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參考及鏈接 Nt,]00S\w  
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